China makes progress in 3-nm chips without advanced lithography tools

Chinese researchers have made early strides in pushing semiconductor processing nodes below 3-nm using older lithography technology, as more advanced extreme ultraviolet lithography (EUV) tools from ASML remain blocked under US sanctions.
The breakthrough marks the latest progress in China’s drive to chart an alternative path to advanced chipmaking amid US export restrictions. Under current export control rules, Dutch equipment giant ASML is barred from selling its state-of-the-art EUV machines...